PureLab Glovebox Compact Evaporator

The PureLab Series of Compact Evaporator Systems is an ideal solution for thin film deposition research on an economical budget. Advanced deposition rate control in a compact package distinguishes these systems from the competition.

The deposition controller system allows users to produce more reliable and accurate multi-layer depositions than with a manually controlled process.

The Compact Thermal Evaporator is integrated seamlessly into the base of the Glove Box System. These systems can include bell jar vacuum chambers with mechanical hoists. They can also come equipped with clam shell style lids for easy operator access.

Compact turbo pumping backed by a dry diaphragm pump provides a vacuum base pressure less than 9.0E-07 Torr. A display control unit enables auto pump down and venting system operations.

The PureLab Compact Thermal Evaporator separates itself from the competition by including recipe based depositions with automated pumping sequences in a small and economical package.

Available System Features

Consuming a floor plan footprint of approximately 2 feet wide and 3 feet deep with an overall height of less than 5 feet the Compact Series fits perfectly within the foot print of a 2 Glove PureLab Glove Box.

The Compact Thermal Evaporator can be used in the following applications; as a thermal evaporator, sputtering system or electron beam evaporator. The following information details the system available features common to each deposition type.

• Ø10" x 17"H Lift-Off Vacuum Chamber
• Single Unit 19" Electrical Rack Frame Enclosure
• Turbo Molecular Drag Pumping Package
• 1.4 cfm Dry Diaphragm Mechanical Backing Pump
• Compact Full Range Pirani / Cold Cathode Vacuum Gauge
• Deposition Controller Unit
• Single Quartz Crystal Rate Sensor
• Substrate Stage Fixturing
• Source Configuration

Compact Evaporator Series Process Configuration Options

The PureLab Compact Thermal Evaporator design provides you with an economical product while maintaining the flexibility to configure a unique solution with several available options to meet the needs of your research application.

• Co-Deposition Process Control Upgrade: Includes a water cooled high current common electrical feed through, an additional power controller. Co-Deposition controller and an additional quartz crystal rate sensor. This ability to cooperatively evaporate and accurately control two thin film material layers simultaneously.
• 2-Port Glove Box Integration Upgrade: Includes an integration style vacuum chamber, a counterbalance chamber hoist with a guide rail motion system and a 2-port glove box with a single column gas purification system, an auto purge valve and solid state O₂ and H₂O analyzers. Optional 6" and 15" antechamber may be configured as necessary depending on the application.
• Process Automated Substrate Shutter Assembly Option: Is pneumatically controlled by an output signal from the deposition controller, and will block thin film material vapor on substrate sizes up to 100 mm in diameter.
• Substrate Mask Support Plate Option: Includes an Aluminum clamp ring to support shadow mask pattern sheets, and is easily interchanged on the substrate holder to produce complete devices in a single PureLab Compact Thermal Evaporator

Resistive Thermal Evaporation
Designed for research and development involving organic materials science, organic light emitting diode technology, and flexible OLED display barrier coatings. Research fields include organic light emitting diodes (OLED), flat panel displays, solar panels, photovoltaics, nanotechnology, materials science, thin film battery metallization and much more.

Electron Beam Evaporation
For research and development involving high vacuum evaporation of pure metallic elements in addition to numerous alloys and compounds. Thin film research applications making use of electron beam evaporation technology include medical, metallurgical, telecommunication, micro electronics, optical coating, nanotechnology and the semiconductor industry.

Magnetron Sputter Deposition
Research and development involving photovoltaic and optoelectronic materials and devices. Our magnetron sputtering system may be easily adapted for a variety of leading edge research fields including organic light emitting diodes (OLED), flat panel displays, solar panels, photovoltaics, nanotechnology, materials science and much more.

OPTIONS

Special Substrate Holders and Mask Holders
We have capabilities in stencil mask fabrication, mask changers, etc. Contact factory for additional information and design constraints. Substrate heat Glow discharge or plasma cleaning
Spin Coaters
User-friendly touch screen interface and display 700 process programs 20 steps per program (upgradable with software option) 0.1-second resolution for step times (0 to 999.9 sec/step) Spin speed: 0 to 6,000 rpm Spin speed acceleration 0 to 30,000 rpm/sec unloaded 0 to 23,000 rpm/sec for a 200 mm substrate 0 to 3,000 rpm/sec for a 6" x 6" x .250" photomask recessed chuck
Precision
Spin speed repeatability:	< 0.2 rpm
Spin speed resolution:	< 0.2 rpm
Substrate sizes:	< 1 cm to 200 mm round / 6" x 6" square
Reliability
Indirect drive system protects the spin motor from accidental contact with process chemicals and solvents Vacuum and lid interlock standard
Bowl Design
Stainless steel construction ETFE-coated spin bowl option for material compatibility Optional polyethylene liners available Optional polyethylene/Teflon splash ring Closed and optional open lid designs for process flexibility Drain and exhaust ports located in the bottom of the bowl

Hot Plates
Operation	Manual Load
Process Control	Program
Temperature Resolution	1ºC
Temperature range	50-600ºC
Substrate Size	6"

UV Cleaning

UV ozone cleaning system that will not damage delicate electronic devices. This easy to operate system uses a unique combination of ultraviolet radiation, ozone, and heat to gently, yet effectively, remove organic materials from a variety of substrates, including: silicon, gallium arsenide, sapphire, metals, ceramics, quartz and glass. The versatile UV-1 is well-suited for a variety of applications such as substrate cleaning, photoresist descumming, improving wettability, and UV curing. By operating at atmospheric pressure, the UV-1 eliminates the need for a cumbersome, high maintenance, vacuum system. This system is specifically designed to be used in a inert Glove Box application.

Desktop Dispensing Robots
Model I&J4100-LF is a compact Cartesian robot featuring all the programming functions and the same memory capacity of the larger I&J7000 industrial robots. The I&J4100-LF is an ideal bench robot for automated dispensing when cost and bench space are important considerations. The dispensing robot has a working area 7.87 x 5.9 (200mm x 150mm) and can accept dispensing valves and syringes with tooling loads of 3Kg and 1Kg.
Features
Dispensing area of 7.87 x 5.9 (200mm x 150mm) Repeatability 0.01mm for precision dispensing No computer skills required 100 programs, 4000 points per program Continuous path motion for accurate XYZ dispensing Interpolates lines or arcs for three-dimensional dispensing Teach Pendant and PC programming.
Models (110V/220V CE)
I&J4100-LF 3-Axis Dispensing Robot
I&J4100-LF desktop robot specifications
XYZ Robot Working Area/ mm:	200 / 150 / 50
Load Worktable/Tool:	3kg / 1kg
Speed PTP XY& Z (mm/sec):	500 / 250
Repeatability:	+/- 0.04mm/ Axis
Resolution:	0.02mm/Axis
Data Memory:	100 programs 4000 points/program

Ovens / Furnaces
Innovative Technology, Inc provides both custom and standard integrated vacuum process Ovens and Furnaces ranging up to 1200 degrees Celsius. Below are some photographs of various configurations that are available. All Innovative Technology, Inc Process Ovens and Furnaces are fitted with the latest in temperature, cycle time controls as well as safety parameters allowing for your operators to work in a safe environment. Pressure and temperature performance, constant chamber temperature and vacuum level are made possible by means of a doors seal made from a latest in gasket technology resulting in a hermetically sealed Glove Box and Process Oven integration.
Specifications - SalvisLab Vacucenter VC20 VC50
Useable volume:	(l) 20 50
Max. Temperature (ºC):	200 200
Outside dimensions (WxHxD):	mm 545x375x425 645x475x525
Inside dimensions (wxhxd):	mm 250x250x320 350x350x420
Weight (kg):	34 56
Shelves (standard/max.):	1/3 1/5
Shelf load max. (kg):	20 20
Voltage:	±10% (V) 230/115 230/115
Temperature variation at 100ºC:	(±ºC) 1.7 1.7
Temperature fluctuation at 100ºC:	(±ºC) 0.2 0.2
Microprocessor:	PID controller
Alphanumeric LCD display:	illuminated
Programming:	Programs x steps 50 x 15 50 x 15 Temperature, time, gradient
Timer (h):	999 999
RS232/RS422 interface:	optional
Digital vacuum indication or control:	optional
Vacuum pump:	optional
Safety class:	3.1